Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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Sep. 2026
Chanxan Laser to Showcase Precision Laser Processing Solutions at SENSOR CHINA 2026
Highlighting Femtosecond, Picosecond, and UV Laser Cu...
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Client Case Study: Anti‑Glare Glass Cover Processing with 30W UV Picosecond Laser
A case study detailing how Chanxan Laser replaced hazardo...
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Client Case Studies: Selective Laser Ablation of Multilayer Composite Film
Evaluating selective laser ablation of 4-ply PET/Alumin...
Laser Scribing & Dicing Systems for High-Thermal Conductive Aluminum Nitride (AlN)
Publish Time: Jul. 14, 2026
Overcome hardness and thermal stress in AlN processing. Discover how Chanxan's UV picosecond lasers achieve micro-crack-free, zero-carbonization cuts.
Precision Laser Processing of Alumina (Al₂O₃) Ceramics: Substrate Dicing & Drilling Solutions
Publish Time: Jul. 13, 2026
Chanxan's UV picosecond laser processing system delivers high-precision Alumina (Al₂O₃) ceramic substrate cutting & drilling.
Laser Dicing of Compound Semiconductors (GaAs/InP): Balancing Fragility and Precision
Chanxan picosecond laser dicing machine provides zero-kerf stealth dicing for brittle GaAs & InP wafers. Maximize die strength and optical surface quality for telecom lasers.
Precision Laser Dicing for Glass Wafers and TGV Substrates
Discover Chanxan's picosecond laser wafer dicing machine for advanced packaging glass substrates. Features <3μm HAZ, <5μm kerf, and micro-crack-free TGV processing.
Precision Laser Dicing for GaN-on-Silicon and GaN-on-Sapphire Wafers
Publish Time: Jul. 10, 2026
Chanxan picosecond laser wafer dicing machine delivers <200 nm sidewall damage & 5 μm kerf width for GaN-on-Si & GaN-on-Sapphire.
Laser Dicing Solutions for SiC Wafers: Overcoming High Hardness & Thermal Stress
Explore advanced picosecond laser dicing solutions for silicon carbide (SiC) wafers. Resolve high hardness & mechanical blade dicing limitations.
How to Minimize Edge Chipping in Silicon Wafer Laser Dicing?
Eliminate chipping & micro-cracks with the Chanxan CW-6050PZ picosecond wafer dicing machine. Achieve a <3μm HAZ & narrow scribe streets for silicon, SiC & glass.
Advanced Ceramics Laser Processing & Micro-Drilling
Publish Time: Jul. 09, 2026
Achieve crack-free cutting and dense via drilling for advanced ceramics. High-precision laser solutions for Alumina, AlN, Zirconia & LTCC/HTCC substrates.
Optical & Photonic Laser Processing
Industrial laser equipment for Fused Silica, BK7 & Lithium Niobate processing. Build turnkey systems to eliminate subsurface damage & wavefront distortion.
