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04
Sep. 2026
Client Case Study: Anti‑Glare Glass Cover Processing with 30W UV Picosecond Laser
A case study detailing how Chanxan Laser replaced hazardo...
03
Client Case Studies: Selective Laser Ablation of Multilayer Composite Film
Evaluating selective laser ablation of 4-ply PET/Alumin...
18
Aug. 2026
Chanxan Laser to Showcase Precision Laser Processing Solutions at Medtec China 2026
Chanxan Laser will participate in Medtec China 2026 at B...
Precision Laser Dicing for GaN-on-Silicon and GaN-on-Sapphire Wafers
Publish Time: Jul. 10, 2026
Chanxan picosecond laser wafer dicing machine delivers <200 nm sidewall damage & 5 μm kerf width for GaN-on-Si & GaN-on-Sapphire.
Laser Dicing Solutions for SiC Wafers: Overcoming High Hardness & Thermal Stress
Explore advanced picosecond laser dicing solutions for silicon carbide (SiC) wafers. Resolve high hardness & mechanical blade dicing limitations.
How to Minimize Edge Chipping in Silicon Wafer Laser Dicing?
Eliminate chipping & micro-cracks with the Chanxan CW-6050PZ picosecond wafer dicing machine. Achieve a <3μm HAZ & narrow scribe streets for silicon, SiC & glass.
Advanced Ceramics Laser Processing & Micro-Drilling
Publish Time: Jul. 09, 2026
Achieve crack-free cutting and dense via drilling for advanced ceramics. High-precision laser solutions for Alumina, AlN, Zirconia & LTCC/HTCC substrates.
Optical & Photonic Laser Processing
Industrial laser equipment for Fused Silica, BK7 & Lithium Niobate processing. Build turnkey systems to eliminate subsurface damage & wavefront distortion.
Semiconductor Wafer Laser Dicing & Drilling
Boost die yield with Chanxan high-precision wafer laser dicing solutions. Zero-chipping cutting, grooving & micro-drilling for silicon, SiC, GaN & glass wafers.
Laser Processing for Solid-State Battery & New Energy Materials
Precision laser cutting, micro-drilling, and structuring for brittle solid-state electrolyte ceramics, ceramic-coated films, and thin glass separators. Request a technical solution.
Sapphire Laser Processing & Cutting Solutions
Chanxan ultra-fast laser solutions for sapphire processing. Precision crack-free cutting, micro-hole drilling, and contouring for sapphire wafers, optical lens covers, and LED substrates.
Precision Technical Glass Laser Processing Solution
Chanxan provides advanced laser processing solutions for technical glass (UTG, quartz, borosilicate, OLED). Non-contact precision cutting & micro-drilling ensures zero micro-cracks, no therma...
